SiP/SiM/ electrical / heat transfer / stress design analysis/
fan out / WL_CSP / 2.5D, 3D stacking/ embedded component package/
...and other process services
If you are looking for IC packaging or IC testing services, tell us the packaging technology and specifications you need, MicroIP will find the packaging/testing technology that suits your needs around the world.
Tong Hsing Electronic Industries
Phoenix Pioneer Technology